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K24V2

K24V2 is latest 2U 4-node server which is optimized for data center and high-performance computing. K24V2 is powered by 8 4th Gen Intel® Xeon® Scalable Processors with liquid cooling solution covering CPU, memory and VR module, PUE below 1.1. K24V2 is optimized in terms of heat dissipation, power supply, monitoring and management to meet the requirements of HPC customers for the ultimate performance experience and new generation of high-density energy-saving data centers.

Key Features
  • Extreme Performance

    Industry-leading CPU computing power, Powered by 8 4th Gen Intel® Xeon® Scalable Processors in 2U space 

    Up to 4TB DDR5 Memory and NDR InfiniBand, suppressing latency and breaking the obstacles of memory bandwidth


  • High Efficiency Liquid Cooling

    Reliable full cold-plate liquid cooling design for CPU+DIMM+VR, optimizing PUE≤1.1

    Less cooling devices deployment in data center, significantly optimizing datacenter TCO


  • Intelligent Maintenance

    Precise water leakage detection, leakage node can be located accurately and powered off automatically, effectively reducing risks

    3D dynamic management for cabinet environment monitoring temperature, humidity and leakage information in real time, achieving intelligent maintenance


  • Flexible Deployment

    Integrated and simplified delivery of the whole cabinet

    Exclusive air-liquid CDU solution, quickly deploying liquid-cooled system without data center modification

    Supporting Liquid-liquid CDU, one-site agile deployment of datacenter


Technical Specifications

Model

K24-X2-A0-R0-00 (Air cooling) /K24-X2-A0-R0-00 (Liquid cooling)

Specifications

4 independent hot-swappable nodes in 2U Chassis

Storage

Config 1: 8*2.5 inches SATA/NVMe SSD (7mm)

Config 2: 4*2.5 inches SAS/NVMe SSD (15mm)

PSU

4*2200W Platinum/Titanium PSUs, support N+N redundancy

Cooling

Air cooling: Four or five 8086 fans in the front of the chassis, N+1 redundancy

Liquid cooling: 2x8080 fans in the front of the chassis, N+1 redundancy, node liquid cooling

Chassis

447mm(W)*87mm(H)*896mm(D), without chassis lugs

447mm(W)*87mm(H)*921mm(D), with lugs

Operating temperature

Air cooling: 5℃~40℃

Liquid cooling: 5℃~45℃

Weight

net weight：＜51kg (fully equipped);

gross weight：＜75kg (host+package+rail+accessory+pallet)

Air cooling and liquid cooling are different, refer to the technical white paper for details

Node

KM1270-X2-A0-R0-00 (Air cooling) /KM1270-X2-C0-R0-00 (Liquid cooling)

Specifications

1U half-width 2-socket compute node

CPU

2*4th Gen Intel® Xeon® Scalable Processors per node, TDP 350W, 4 UPI links

Chipset

Intel® C740

Memory

16 DDR5 4800MHz RDIMM per node

PCIe expansion

Air cooling: 1 PCIe 5.0 x16+1 PCIe 4.0 x16 slots per node

Liquid cooling: 1 PCIe 5.0 x16 slot per node

IO

Front: 2*USB2.0，1*VGA, 1*PWR button, 1*UID

Rear: 1*RJ45, 1*UID, 1*RST button, 1*micro USB for debug, 1*micro USB

Storage

Config 1: 2*2.5 inches SATA/NVMe SSD(7mm) per node

Config 2: 1*2.5 inches SAS/NVMe SSD(15mm) per node

2*SATA/PCIe M.2 per node

Raid

Raid 0/1，VROC

BMC

Aspeed AST2600

TPM

TPM2.0

NIC

1*OCP 3.0 card per node, can also support PCIe network card

OS

Windows Server2019/2022，Red Hat Enterprise Linux8.6/9，Debian9.x，

CentOS8.5，VMware ESXi7.0/8.0，Ubuntu22.4



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